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Publications of IEC/TC 47

DIN EN 60191-6-5 2002-05 Standards Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001 More  Order from DIN Media
DIN EN 60191-6-6 2002-02 Standards Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001 More  Order from DIN Media
DIN EN 60749-1 2003-12 Standards Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003 More  Order from DIN Media
DIN EN 60749-2 2003-04 Standards Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002 More  Order from DIN Media
DIN EN 60749-8 2003-12 Standards Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003 More  Order from DIN Media
DIN EN 60749-11 2003-04 Standards Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002 More  Order from DIN Media
DIN EN 60749-14 2004-07 Standards Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003 More  Order from DIN Media
DIN EN 60749-16 2003-09 Standards Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003 More  Order from DIN Media
DIN EN 60749-20-1 2009-10 Standards Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More  Order from DIN Media
DIN EN 60749-22 2003-12 Standards Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003 More  Order from DIN Media

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