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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Draft standard

DIN EN IEC 62878-2-603
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English

Title (German)

Technologie zur Einbettung von Bauelementen - Teil 2-603: Leitfaden für gestapelte elektronische Module - Prüfverfahren für die elektrische Konnektivität innerhalb des Moduls (IEC 91/1802/CD:2022); Text Deutsch und Englisch

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2023-07

Original language German , English

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Table of contents

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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Economic benefits

DIN SPEC

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN IEC 62878-2-603 Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English

Responsible national committee

Daniel Failer

DIN EN IEC 62878-2-603
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English