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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 682

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DIN EN IEC 63609-1	2024-11-19	Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant More	Comment
DIN EN IEC 63609-2	2024-11-19	Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites More	Comment
DIN EN IEC 63609-3	2024-11-19	Measurement method used in thermal design for electronics assemblies - - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards More	Comment
DIN EN IEC 61760-4	2024-11-19	Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices More	Comment
DIN EN IEC 61760-1	2024-08-27	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More	Comment
DIN EN IEC 63516	2024-07-03	Fixed folding Durability test method for flexible opto-electric circuit boards More	Comment
DIN EN IEC 61189-3-303	2024-06-28	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards More	Comment
DIN EN IEC 61249-2-54	2024-06-28	Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications More	Comment
DIN EN IEC 60068-2-83	2023-11-28	Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste More	Comment
DIN EN IEC 61249-2-53	2023-11-10	Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad More	Comment

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