Projekt
Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
Beginn
2011-09-30
Geplante Dokumentnummer
IEC 47F/105/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
