Projekt
IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Beginn
2013-03-29
Geplante Dokumentnummer
IEC 47F/148/CDV
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
