Projekt
Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Beginn
2011-07-29
Geplante Dokumentnummer
IEC 47F/96/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
