Projekt
IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
Beginn
2012-07-27
Geplante Dokumentnummer
IEC 47F/125/CD
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
