Projekt
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass
Beginn
2012-08-03
Geplante Dokumentnummer
IEC 47F/126/CD
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
