Projekt
IEC 62047-13 Ed.1: SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Beginn
2009-07-03
Geplante Dokumentnummer
IEC 47F/72/CDV
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
