Projekt
Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging
Beginn
2007-03-30
Geplante Dokumentnummer
IEC 47/1907/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente