Norm-Entwurf [NEU]

OVE EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV) (english version)

Titel (englisch)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV) (english version)

Ausgabe 2024-11-01
Frist zur Stellungnahme bis 2024-12-01
Originalsprache Englisch
Preis ab 26,97 €
Kaufen bei DIN Media
Inhaltsverzeichnis