Norm-Entwurf
OVE EN IEC 61189-2-808
OVE EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 91/1833/CDV) (english version)
Titel (englisch)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 91/1833/CDV) (english version)