Norm
[AKTUELL]
EIA JESD 22-B113B
EIA JESD 22-B113B
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
Titel (englisch)
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products