Norm-Entwurf
OVE EN 63011-2
OVE EN 63011-2
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect (IEC 47A/1036/CDV) (english version)
Titel (englisch)
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect (IEC 47A/1036/CDV) (english version)