Projekte von IEC/SC 47E

IEC 47E/452/FDIS 2008-12-12 Halbleiterbauelemente - Teil 16-5: Integrierte Mikrowellenschaltkreise - Oszillatoren Mehr  Kontakt zu DIN 
IEC 47E/352/NP 2007-10-12 Proposal of the German NC: (Future IEC 60747-x-y): Semiconductor devices - Magnetic and capacitive coupler for safe isolation Mehr  Kontakt zu DIN 
IEC 47E/342/NP 2007-09-21 Proposal of the Japanese NC: (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators Mehr  Kontakt zu DIN 
IEC 47E/328/NP 2007-05-11 (Future IEC 60747-14-x): Semiconductor devices - Discrete devices - Part 14-x: Semiconductor sensors - Test method of CMOS image sensor module Mehr  Kontakt zu DIN 
IEC 47E/329/NP 2007-05-11 (Future IEC 60747-14-7): Semiconductor devices - Discrete devices - Part 14-7: Semiconductor sensors - Humidity Mehr  Kontakt zu DIN 
IEC 47E/312/NP 2006-09-22 (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators Mehr  Kontakt zu DIN 
IEC 47E/299/NP 2006-03-31 (Future IEC 60747-14-6): Semiconductor devices - Discrete Devices - Part 14-6: Semiconductor sensors Test method of CMOS imagesensor module Mehr  Kontakt zu DIN 
IEC 47E/297/NP 2006-01-27 (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators Mehr  Kontakt zu DIN 
IEC 47E/293/NP 2005-12-02 (Future IEC 60747-14-5): Discrete semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor Mehr  Kontakt zu DIN 
IEC 47E/230/DC 2002-10-11 Maintenance of IEC 60747-9 and call for experts Mehr  Kontakt zu DIN