Projekte von DKE/K 682

IEC 91/877/DC 2009-07-03 Maintenance - Call for comments/proposals for the revision of IEC 60194 Ed. 5.0, and call for experts for maintenance team Mehr  Kontakt zu DIN 
IEC 107/105/DC 2009-06-12 Maintenance of IEC/TR 62240: Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range Mehr  Kontakt zu DIN 
IEC 91/869/DC 2009-05-29 Maintenance - Call for comments / proposals for amendment / revision on IEC 61191-1 Ed. 1.0 and IEC 61191-2 Ed. 1.0, and call for experts for maintenance team Mehr  Kontakt zu DIN 
IEC 91/870/DC 2009-05-29 Maintenance - Call for comments / proposals for amendment / revision on IEC 61192-1 Ed. 1.0 and IEC 61192-2 Ed. 1.0, and call for experts for maintenance team Mehr  Kontakt zu DIN 
IEC 91/848/DC 2009-02-06 Maintenance of IEC 60068-2-82 Ed. 1.0: ENVIRONMENTAL TESTING - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components Mehr  Kontakt zu DIN 
IEC 91/903/CDV 2009-01-30 Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste Mehr  Kontakt zu DIN 
IEC 91/905/CDV 2008-11-07 IEC 61182-2-2: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description Mehr  Kontakt zu DIN 
IEC 91/969/CD 2008-10-10 IEC 61189-11 Ed.1: Test methods for electrical materials,interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys Mehr  Kontakt zu DIN 
IEC 91/800A/DC 2008-09-19 Proposal for Amendment to IEC 61190-1-3 Ed. 2 (Lead-free solder alloys) - Additional information and extension of closing date from 2008-09-26 to 2008-10-03 Mehr  Kontakt zu DIN 
IEC 91/805/NP 2008-08-29 Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull) Mehr  Kontakt zu DIN 

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