Projekte von DKE/K 682

IEC 91/1029/CDV 2012-03-09 Verfahren zur Erosionsprüfung für Wellenlötausrüstungen bei Verwendung von geschmolzener, bleifreier Lotlegierung - Teil 1: Erosionsprüfverfahren für metallische Werkstoffe ohne Oberflächenbehandlung Mehr  Kontakt zu DIN 
IEC 93/316/CD 2011-09-30 IEC 62699 Ed 1.0: Mapping rules and exchanges methods for hetrogeneous parts libraries Mehr  Kontakt zu DIN 
IEC 91/1007/CD 2011-09-16 IEC 62326-20 Ed.1: Electronic circuit board for high-brightness LEDs Mehr  Kontakt zu DIN 
IEC 91/994/CD 2011-09-02 IEC 60068-3-13: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering Mehr  Kontakt zu DIN 
IEC 91/1000/NP 2011-09-02 Future 61189-2-629: Test method of adhasion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application Mehr  Kontakt zu DIN 
IEC 91/1003/CD 2011-09-02 IEC 61189-3-913 Ed.1: Test methods for electronic circuit board for high-brightness LEDs Mehr  Kontakt zu DIN 
IEC 91/996/NP 2011-09-02 Future IEC 62326-16: Printed boards-Device Embedded Substrate-Scope and Definition Mehr  Kontakt zu DIN 
IEC 91/997/NP 2011-09-02 Future IEC 62326-17; Printed boards-Device Embedded Substrate-TEG(test element group) Mehr  Kontakt zu DIN 
IEC 91/998/NP 2011-09-02 Future IEC 62326-18: Printed boards-Device Embedded Substrate-Test Method Mehr  Kontakt zu DIN 
IEC 91/999/NP 2011-09-02 Future IEC 62326-19: Printed boards-Device Embedded Substrate-Design Guide Mehr  Kontakt zu DIN