Projekte von DKE/K 682

IEC 52/677/CD 1996-10-04 IEC 2326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C Mehr  Kontakt zu DIN 
IEC 52/794/CDV 1996-03-22 Änderung 3 zu IEC 1189-2: Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen (IEC 52/644/CD:1996) Mehr  Kontakt zu DIN 
IEC 52/795/CDV 1996-03-22 Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) (IEC 61189-3:2007) Mehr  Kontakt zu DIN 
IEC 91/80/NP 1995-05-05   Mehr  Kontakt zu DIN 
IEC 107/106/PAS IEC/PAS 62647-1 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 1: Lead-free management Mehr  Kontakt zu DIN 
IEC 107/108/PAS IEC/PAS 62647-2 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems Mehr  Kontakt zu DIN 
IEC 107/126/PAS Future IEC/PAS 62686-1 Ed.1: General Requirements for High Reliability Components - Part 1: Integrated Circuits and Discrete Semiconductors Mehr  Kontakt zu DIN 
IEC 107/124/PAS IEC/PAS 62647-3 Ed.1: Aerospace and defence electronic systems containing lead free solder - Part 3: Performance testing for systems containing lead free solder and finishes Mehr  Kontakt zu DIN 
IEC 91/956/PAS IEC/PAS 61249-6-3 Ed.1: Specification for finished fabric woven from ''E'' glass for printed boards Mehr  Kontakt zu DIN 
IEC 107/130/PAS IEC/PAS 62647-21 Ed.1: Aerospace and defence electronic systems containing lead free-solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics Mehr  Kontakt zu DIN 

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