Projekte von DKE/K 682

IEC 91/240/NP 2001-03-30 Test Method for Halogen-free Copper-Clad Laminates Mehr  Kontakt zu DIN 
IEC 91/445/CDV 2001-02-23 Leiterplatten - Teil 3: Sicherheits-Zertifizierung von starren Leiterplatten für elektronische Baugruppen (IEC 91/384/CD:2003) Mehr  Kontakt zu DIN 
IEC 91/194/DC 2000-08-04 Maintenance draft: IEC 60140 Mehr  Kontakt zu DIN 
IEC 91/197/CD 1999-10-15 Prüfung 5E02: Oberflächenisolationswiderstand, Baugruppen (IEC 91/197/CD:2000) Mehr  Kontakt zu DIN 
IEC 52/807/NP 1999-04-23 Proposal of the US NC: IEC 61249-1: Materials for interconnecting structures - Part 1: Generic Specification Mehr  Kontakt zu DIN 
IEC 52/756/NP 1997-11-14 Proposal of the USNC: Generic computer aided manufacturing format (GenCAM) Mehr  Kontakt zu DIN 
IEC 91/119/CD 1997-07-25 IEC 61761: Generic specification - Capability approval for surface mount technologies Mehr  Kontakt zu DIN 
IEC 52/732/CDV 1997-06-06 IEC 61193-2: Guidance on the use of IEC/ISO publications and quality assessment systems - Part 2: Guide to the implementation of ISO 9000 quality standards within the IECQ system for printed boards and printed board assemblies Mehr  Kontakt zu DIN 
IEC 40/939/NP 1997-05-09 Proposal of the Japanese NC: Packaging of components for automatic handling - Part X: Reusable and/or recyclable plastic reels Mehr  Kontakt zu DIN 
IEC 46C/276/CD 1997-02-28 Amendment to IEC 1156-2 for values of characteristic impedance and structural return loss (SRL) and return loss (RL) Mehr  Kontakt zu DIN