Projekte von DKE/K 682

IEC 91/530/NP 2005-06-24 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint. Part 3: Cyclic drop test Mehr  Kontakt zu DIN 
IEC 91/531/NP 2005-06-24 The marking for presence and non-presence of the specified chemical substance in materials, components and mounted boards use in electrical and electronic equipment Mehr  Kontakt zu DIN 
IEC 91/532/NP 2005-06-24 Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste Mehr  Kontakt zu DIN 
IEC 107/29/CD 2004-11-12 Prozessmanagement für die Luftfahrtindustrie - Norm für die Akkommodation von atmosphärischen Strahlungseffekten über Einzelereignis-Effekte innerhalb elektronischer Luftfahrtausrüstungen (IEC 107/29/CD:2004) Mehr  Kontakt zu DIN 
IEC 91/486/NP 2004-09-10 Detail Specification for Right-angled Optical Board Connector using Glass Fibers Mehr  Kontakt zu DIN 
IEC 91/476/NP 2004-08-20 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices Mehr  Kontakt zu DIN 
IEC 91/469/NP 2004-07-02 Specification for Flexible Optical Board using Glass Fibre and its test methods Mehr  Kontakt zu DIN 
IEC 91/470/NP 2004-07-02 Specification for rigid optical board using planar waveguide and its test methods Mehr  Kontakt zu DIN 
IEC 91/471/NP 2004-07-02 Specification for optical board connector type SF using glass fibre Mehr  Kontakt zu DIN 
IEC 91/432/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges Mehr  Kontakt zu DIN