Projekte von DKE/UK 631.4

IEC 47D/673/CD 2006-11-03 NP-CD: IEC 60191-6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) Mehr  Kontakt zu DIN 
IEC 47D/652/NP 2006-04-14 Design guide for semiconductor packages - Ball Grid Array Package (BGA) Mehr  Kontakt zu DIN 
IEC 47D/653/NP 2006-04-14 Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) Mehr  Kontakt zu DIN 
IEC 47D/647/CD 2006-02-17 IEC 60191-2/f64, Ed 1: Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline) Mehr  Kontakt zu DIN 
IEC 47D/713/FDIS 2005-07-15 IEC 60191-2/F63/Ed. 1: Proposed new package outline - Power Package with 34 Pins (to be published as Outline 181E) Mehr  Kontakt zu DIN 
IEC 47D/590/DC 2004-08-27 Proposed SC47D Scope Change (document also of interest to TC 48) Mehr  Kontakt zu DIN 
IEC 47D/539A/NP 2004-01-30 RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP) Mehr  Kontakt zu DIN 
IEC 47D/576/NP 2004-01-30 Proposed IEC 60191-6-xx: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA Mehr  Kontakt zu DIN 
IEC 47D/539/NP 2003-04-11 Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch Mehr  Kontakt zu DIN 
IEC 47D/540/NP 2003-04-11 Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts Mehr  Kontakt zu DIN 

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