Projekte von DKE/K 631

IEC 47/2085/FDIS 2008-01-25 Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate Mehr  Kontakt zu DIN 
IEC 47/1911A/DC 2007-06-15 Proposal of the French NC: Reliability engineering in electronics(Numbering of clauses/paragraphs) Mehr  Kontakt zu DIN 
IEC 47/1905/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-7): Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer Mehr  Kontakt zu DIN 
IEC 47/1907/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging Mehr  Kontakt zu DIN 
IEC 47/1906/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films Mehr  Kontakt zu DIN 
IEC 47A/767/NP 2006-12-01 Future IEC 62433-1: EMC IC modelling - Part 1: General modelling framework Mehr  Kontakt zu DIN 
IEC 47/1881/NP 2006-07-28 Proposal of the French NC: Audit for obsolescence management Mehr  Kontakt zu DIN 
IEC 47/1868/NP 2006-05-26 (Future IEC 62047-6): Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials Mehr  Kontakt zu DIN 
IEC 110/85/NP 2006-05-26 (Future IEC 61747-5-3 Ed.1.0) Liquid crystal display devices - Part 5-3: Liquid crystal display devices - Glass strength and reliability Mehr  Kontakt zu DIN 
IEC 110/78/NP 2006-04-14 (Future IEC 61988-2-4) Plasma Display Panels - Part 2-4: Measuring methods - Visual quality Mehr  Kontakt zu DIN