• Normungsroadmap Wasserstofftechnologien Laden Sie sich hier die Roadmap herunter

    Jetzt downloaden
  • Ruderboot von oben

    DIN-Mitglied werden Profitieren Sie von vielen Vorteilen

    Mehr erfahren
 

Projekte von DKE/K 631

IEC 47F/151/CD 2013-03-22 IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47F/149/CD 2013-02-22 IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass Mehr  Kontakt zu DIN 
IEC 47A/899/CD 2013-02-01 IEC 62132-1 Ed.2: Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions Mehr  Kontakt zu DIN 
IEC 47F/146/CD 2013-01-11 IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films Mehr  Kontakt zu DIN 
IEC 47F/127/CD 2012-08-10 IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials Mehr  Kontakt zu DIN 
IEC 47F/128/CD 2012-08-10 IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates Mehr  Kontakt zu DIN 
IEC 47F/126/CD 2012-08-03 IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass Mehr  Kontakt zu DIN 
IEC 47F/125/CD 2012-07-27 IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47/2155/CDV 2012-03-02 Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 28: Prüfung der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Direct Contact Charged Device Model (DC-CDM) Mehr  Kontakt zu DIN 
IEC 47F/106/NP 2011-09-30 Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass Mehr  Kontakt zu DIN 

Zum Seitenanfang