Projekte von DKE/K 631

IEC 47/1394/FDIS 1996-03-22 Amendment 3 to IEC 749: Withdrawal of tests Db and Z/AD Mehr  Kontakt zu DIN 
IEC 47A/541/CDV 1995-11-10 IEC 61748: Anerkennungsverfahren von Fertigungslinien (QML) für Multi Chip Modules (MCM) (IEC 47A/541/CDV:1999) Text English Mehr  Kontakt zu DIN 
IEC 47A/403/CDV 1995-09-01 Proposal for amendment to Draft IEC 748-5- Chapter V: Acceptance and reliability Mehr  Kontakt zu DIN 
IEC 47C/100/CD 1995-05-26 Essential ratings and characteristics of duplexer modules with pigtail Mehr  Kontakt zu DIN 
IEC 47C/173/FDIS Amendment 3 to IEC 60747-5: Semiconductor devices - Discrete devices and integrated circuits - Part 5: Optoelectronic devices Mehr  Kontakt zu DIN 
IEC 47/1567/RV Report of voting on document 47/1555/QP Mehr  Kontakt zu DIN 
IEC 47/1449/PAS EIA/JESD22-B116 - Wire bond shear test method Mehr  Kontakt zu DIN