Projekte von IEC/TC 91

IEC 91/378/NP 2003-03-07 IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications Mehr  Kontakt zu DIN 
IEC 91/379/NP 2003-03-07 IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly Mehr  Kontakt zu DIN 
IEC 93/167A/NP 2002-12-06 Comments received on 93/167/NP (Interoperability Verilog and VHDL (Technical report)) Mehr  Kontakt zu DIN 
IEC 93/166A/NP 2002-12-06 Comments received on 93/166/NP (IEC 61926-2: Standard Test Languages - Part 2: Test Language for All Systems Requirements) Mehr  Kontakt zu DIN 
IEC 93/162A/NP 2002-12-06 Comments received on 93/162/NP (A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells, and blocks) Mehr  Kontakt zu DIN 
IEC 93/165A/NP 2002-12-06 Comments received on 93/165/NP (Standard Delay Format (SDF) for the Electronic Design Process) Mehr  Kontakt zu DIN 
IEC 93/170/NP 2002-11-29 IEC 61691-4: Behavioural Languages - Part 4: Standard Hardware Description Language based on Verilog 2001 Mehr  Kontakt zu DIN 
IEC 93/168/NP 2002-11-01 IEC 61691-5 Behavioural Languages; Part 5; Standard Hardware Description Language based on VHDL 2002 Mehr  Kontakt zu DIN 
IEC 93/165/NP 2002-10-04 Standard Delay Format (SDF) for the Electronic Design Process Mehr  Kontakt zu DIN 
IEC 93/155/DTR 2002-08-16 IEC 62014-4: Cookbook for integrated Circuit model IECM described in IEC 62014-3 Mehr  Kontakt zu DIN 

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