Projekte von IEC/TC 91

IEC 91/476/NP 2004-08-20 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices Mehr  Kontakt zu DIN 
IEC 93/204/NP 2004-08-13 Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration Mehr  Kontakt zu DIN 
IEC 91/469/NP 2004-07-02 Specification for Flexible Optical Board using Glass Fibre and its test methods Mehr  Kontakt zu DIN 
IEC 91/470/NP 2004-07-02 Specification for rigid optical board using planar waveguide and its test methods Mehr  Kontakt zu DIN 
IEC 91/471/NP 2004-07-02 Specification for optical board connector type SF using glass fibre Mehr  Kontakt zu DIN 
IEC 93/201/DC 2004-05-14 Withdrawal of two New Work Item Proposals from the programme of work Mehr  Kontakt zu DIN 
IEC 91/432/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges Mehr  Kontakt zu DIN 
IEC 91/433/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics Mehr  Kontakt zu DIN 
IEC 91/407/NP 2003-07-11 IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips) Mehr  Kontakt zu DIN 
IEC 91/405/NP 2003-07-11 IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards Mehr  Kontakt zu DIN 

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