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Projekte von IEC/SC 47F

IEC 47F/107/NP 2011-09-30 Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47F/105/NP 2011-09-30 Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47F/95/NP 2011-07-29 Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials Mehr  Kontakt zu DIN 
IEC 47F/96/NP 2011-07-29 Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates Mehr  Kontakt zu DIN 
IEC 47F/91/NP 2011-07-22 Future IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes Mehr  Kontakt zu DIN 
IEC 47F/155/FDIS 2011-02-18 IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials Mehr  Kontakt zu DIN 
IEC 47F/75/NP 2011-02-18 (Future IEC 62047-19) Semiconductor devices -Micro-electromechanical devices - Part 19: Electronic compasses Mehr  Kontakt zu DIN 
IEC 47F/46/NP 2010-02-26 (Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films Mehr  Kontakt zu DIN 
IEC 47F/47/NP 2010-02-26 (Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials Mehr  Kontakt zu DIN 
IEC 47F/70/CDV 2009-10-30 IEC 62047-14 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials Mehr  Kontakt zu DIN