Suchergebnisse
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Ergebnisse in:
IEC 47E/200/FDIS
IEC 60747-16-1, Ed.1: Semiconductor devices, Part 16-1: Microwave integrated circuits - Amplifiers
IEC 47E/230/DC
Maintenance of IEC 60747-9 and call for experts
IEC 47E/293/NP
(Future IEC 60747-14-5): Discrete semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 47E/297/NP
(Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/299/NP
(Future IEC 60747-14-6): Semiconductor devices - Discrete Devices - Part 14-6: Semiconductor sensors Test method of CMOS imagesensor module
IEC 47E/312/NP
(Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/328/NP
(Future IEC 60747-14-x): Semiconductor devices - Discrete devices - Part 14-x: Semiconductor sensors - Test method of CMOS image sensor module
IEC 47E/329/NP
(Future IEC 60747-14-7): Semiconductor devices - Discrete devices - Part 14-7: Semiconductor sensors - Humidity
IEC 47E/342/NP
Proposal of the Japanese NC: (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/352/NP
Proposal of the German NC: (Future IEC 60747-x-y): Semiconductor devices - Magnetic and capacitive coupler for safe isolation
