Suchergebnisse
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Ergebnisse in:
IEC 47D/543/NP
Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads
IEC 47D/576/NP
Proposed IEC 60191-6-xx: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
IEC 47D/589/FDIS
IEC 60191-2, F56, Ed.1: (will become IEC 60191-2/A11/Ed.1): Proposed new package outline, 5-leaded Power SMD (Outline 176E-a)
IEC 47D/590/DC
Proposed SC47D Scope Change (document also of interest to TC 48)
IEC 47D/647/CD
IEC 60191-2/f64, Ed 1: Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline)
IEC 47D/652/NP
Design guide for semiconductor packages - Ball Grid Array Package (BGA)
IEC 47D/653/NP
Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
IEC 47D/671/CD
NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 47D/673/CD
NP-CD: IEC 60191-6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 47D/674/NP
Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved)
