Suchergebnisse
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Ergebnisse in:
IEC 47C/145/CDV
Measuring method for carrier to noise ratio an analogue laser
IEC 47C/173/FDIS
Amendment 3 to IEC 60747-5: Semiconductor devices - Discrete devices and integrated circuits - Part 5: Optoelectronic devices
IEC 47D/107/FDIS
IEC 191-5: Mechanical standardization of semiconductor devices - Part 5: Recommendations applaying to integrated circuit packages using tape automated bonding (TAB)
IEC 47D/112/CD
Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2
IEC 47D/163A/CDV
Proposed modification of wire ended diode (intended for inclusion into IEC 60191-2)
IEC 47D/170/CDV
IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II
IEC 47D/201/CDV
Halbleiterbauelemente, mechanische Normung - Plastic Thin Shrink Small-Gehäuse (TSSOP/HTSSOP) 1,00 mm Anschlußlänge, Gehäusefamilie, R-PDSO-G (IEC 47D/109/CD 1996)
IEC 47D/210/NP
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/211/NP
Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/213/NP
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
