NA 062
DIN Standards Committee Materials Testing
DIN 50021 [Withdrawn] referenced in following documents:
| Document number | Edition | Title |
|---|---|---|
| WL 5.4110 | 1998-10 | Aerospace series - Structural adhesive films on a modified EP basis - Standard curing temperature 125 °C, applicable from - 55 °C to 80 °C More |
| WL 5.4111 | 1998-10 | Aerospace - Structural adhesive films on a modified EP basis - Standard curing temperature 175 °C, applicable from - 55 °C to 135 °C More |
