NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61810-7 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 60068-2-2/A2 | 1994-07 | Basic environmental testing procedures - Part 2: Tests - Tests B: Dry heat (IEC 60068-2-2:1974/A2:1994) More |
| EN 60068-2-21 | 1999-04 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:1999) More |
| EN 60068-2-27 | 1993-03 | Basic environmental testing procedures - Part 2: Tests - Test Ea and guidance: Shock (IEC 60068-2-27:1987) More |
| EN 60068-2-29 | 1993-04 | Basic environmental testing procedures; part 2: tests; test Eb and guidance: bump (IEC 60068-2-29:1987) More |
| EN 60068-2-30 | 2005-12 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) (IEC 60068-2-30:2005) More |
| EN 60068-2-42 | 2003-09 | Environmental testing - Part 2-42: Tests; Test Kc: Sulphur dioxide test for contacts and connections (IEC 60068-2-42:2003) More |
| EN 60068-2-43 | 2003-09 | Environmental testing - Part 2-43: Tests; Test Kd: Hydrogen sulphide test for contacts and connections (IEC 60068-2-43:2003) More |
| EN 60068-2-45 | 1992-08 | Environmental testing; part 2: test methods; test XA and guidance: immersion in cleaning solvents (IEC 60068-2-45:1980 + corrigendum:1981) More |
| EN 60068-2-45/A1 | 1993-07 | Basic environmental testing procedures; part 2: tests; test XA and guidance: immersion in cleaning solvents (IEC 60068-2-45:1980/A1:1993) More |
| EN 60068-2-58 | 2004-10 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004) More |
