NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60191-3 Beiblatt 1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-6-6 | 2001-03 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term More |
| IEC 60191-6-8 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) More |
