NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60747-15 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-11 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-14 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) More |
| IEC 60749-16 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) More |
| IEC 60749-19 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-2 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC/TR 61340-2-2 | 2000-07 | Electrostatics - Part 2-2: Measurement methods; Measurement of chargeability More |
