NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60384-1 ; VDE 0565-1:2023-10 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-17 | 2023-06 | Environmental testing - Part 2-17: Tests - Test Q: Sealing More |
| IEC 60068-2-20 | 2021-03 | Environmental testing - Part 2-20: Tests - Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads More |
| IEC 60068-2-21 | 2021-07 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices More |
| IEC 60068-2-27 | 2008-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock More |
| IEC 60068-2-30 | 2005-08 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-6 | 2007-12 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) More |
| IEC 60068-2-67 | 1995-12 | Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components More |
| IEC 60068-2-69 | 2017-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
