NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61753-111-09 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-47 | 2005-04 | Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests More |
| IEC 60068-2-49 | 1983 | Basic environmental testing procedures. Part 2 : Tests. Guidance to Test Kc: Sulphur dioxide test for contacts and connections More |
| IEC 60068-2-5 | 2018-04 | Environmental testing - Part 2-5: Tests - Test S: Simulated solar radiation at ground level and guidance for solar radiation testing and weathering More |
| IEC 60068-2-52 | 2017-11 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) More |
| IEC 60068-2-53 | 2010-04 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests More |
| IEC 60068-2-55 | 2013-02 | Environmental testing - Part 2-55: Tests - Test Ee and guidance: Loose cargo testing including bounce More |
| IEC 60068-2-57 | 2013-04 | Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-58 AMD 1 | 2017-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-58 Edition 4.1 | 2017-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
