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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61189-5-601 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-6-19 | 2010-02 | Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage More |
| IEC 60191-6-2 | 2001-12 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages More |
| IEC 60191-6-5 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) More |
| IEC 60194-1 | 2021-02 | Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies More |
| IEC 60194-2 | 2017-12 | Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies More |
| IEC 61190-1-3 | 2017-12 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solder for electronic soldering applications More |
| IEC 62137-3 | 2011-11 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| IEC 61188-5-8 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) More |
