NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-7 | 2011-06 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More |
| IEC 60749-8 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 1 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-9 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking More |
| IEC 61340-5-1 | 2016-05 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements More |
| IEC 61760-4 | 2015-05 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices More |
| IEC 61760-4 AMD 1 | 2018-03 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices; Amendment 1 More |
| IEC 62435-1 | 2017-01 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General More |
| IEC 62435-2 | 2017-01 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms More |
