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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN IEC 61760-2 [CURRENT] references following documents:

Document number Edition Title
IEC 60749-36 2003-02 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More 
IEC 60749-38 2008-02 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory More 
IEC 60749-39 2021-11 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components More 
IEC 60749-4 2017-03 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) More 
IEC 60749-40 2011-07 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge More 
IEC 60749-41 2020-07 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices More 
IEC 60749-42 2014-08 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage More 
IEC 60749-44 2016-07 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices More 
IEC 60749-5 2017-04 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test More 
IEC 60749-6 2017-03 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature More