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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-23 Edition 1.1 | 2011-03 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-24 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| IEC 60749-26 | 2018-01 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) More |
| IEC 60749-27 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) More |
| IEC 60749-27 AMD 1 | 2012-09 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM); Amendment 1 More |
| IEC 60749-27 Edition 2.1 | 2012-09 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) More |
| IEC 60749-28 | 2022-03 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level More |
| IEC 60749-29 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test More |
| IEC 60749-3 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination More |
