NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-19 Edition 1.1 | 2010-11 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-2 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-2 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-20 | 2020-08 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-20-1 | 2019-06 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-22 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-22 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-23 | 2004-02 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-23 AMD 1 | 2011-01 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
