NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-11 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-12 | 2017-12 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency More |
| IEC 60749-13 | 2018-02 | Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere More |
| IEC 60749-14 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) More |
| IEC 60749-15 | 2020-07 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices More |
| IEC 60749-16 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) More |
| IEC 60749-17 | 2019-03 | Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation More |
| IEC 60749-18 | 2019-04 | Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) More |
| IEC 60749-19 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-19 AMD 1 | 2010-07 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
