NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-20 | 2020-08 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 61188-6-4 | 2019-05 | Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design More |
| IEC 61191-3 | 2017-05 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61760-2 | 2021-07 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide More |
| IEC 62090 | 2017-04 | Product package labels for electronic components using bar code and two-dimensional symbologies More |
