NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-69 | 2017-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60068-2-69 AMD 1 | 2019-06 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60068-2-69 Corrigendum 1 | 2018-01 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method; Corrigendum 1 More |
| IEC 60068-2-69 Edition 3.1 | 2019-06 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60068-2-7 | 1983 | Basic environmental testing procedures. Part 2 : Tests. Test Ga and guidance: Acceleration, steady state More |
| IEC 60068-2-7 AMD 1 | 1986 | Basic environmental testing procedures. Part 2 : Tests. Test Ga and guidance: Acceleration, steady state More |
| IEC 60068-2-70 | 1995-12 | Environmental testing - Part 2: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands More |
| IEC 60068-2-74 | 1999-06 | Environmental testing - Part 2: Tests - Test Xc: Fluid contamination More |
| IEC 60068-2-74 AMD 1 | 2018-04 | Environmental testing - Part 2-74: Tests - Test Xc: Fluid contamination; Amendment 1 More |
| IEC 60068-2-74 Edition 1.1 | 2018-04 | Environmental testing - Part 2-74: Tests - Test Xc: Fluid contamination More |
