NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-64 AMD 1 | 2019-10 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance; Amendment 1 More |
| IEC 60068-2-64 Edition 2.1 | 2019-10 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance More |
| IEC 60068-2-65 | 2013-02 | Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method More |
| IEC 60068-2-66 | 1994-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) More |
| IEC 60068-2-67 | 1995-12 | Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components More |
| IEC 60068-2-67 AMD 1 | 2019-07 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components; Amendment 1 More |
| IEC 60068-2-67 Edition 1.1 | 2019-07 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components More |
| IEC 60068-2-68 | 1994-08 | Environmental testing - Part 2: Tests - Test L: Dust and sand More |
| IEC 60068-2-69 | 2017-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60068-2-69 AMD 1 | 2019-06 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
