NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-8 Corrigendum 1 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-9 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking More |
| IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
| IEC 61189-5-504 | 2020-04 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) More |
| IEC 62474 | 2018-11 | Material declaration for products of and for the electrotechnical industry More |
| IEC/TR 61191-7 | 2020-03 | Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies More |
| ISO 25178-1 | 2016-04 | Geometrical product specifications (GPS) - Surface texture: Areal - Part 1: Indication of surface texture More |
| ISO 25178-2 | 2021-12 | Geometrical product specifications (GPS) - Surface texture: Areal - Part 2: Terms, definitions and surface texture parameters More |
| ISO 25178-3 | 2012-07 | Geometrical product specifications (GPS) - Surface texture: Areal - Part 3: Specification operators More |
