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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-32 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-32 AMD 1 | 2010-07 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-32 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-32 Edition 1.1 | 2010-11 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-33 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave More |
| IEC 60749-34 | 2010-10 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling More |
| IEC 60749-35 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC 60749-37 | 2022-10 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer More |
| IEC 60749-38 | 2008-02 | Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory More |
