NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-26 | 2018-01 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) More |
| IEC 60749-27 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) More |
| IEC 60749-27 AMD 1 | 2012-09 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM); Amendment 1 More |
| IEC 60749-27 Edition 2.1 | 2012-09 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) More |
| IEC 60749-28 | 2022-03 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level More |
| IEC 60749-29 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test More |
| IEC 60749-3 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination More |
| IEC 60749-30 | 2020-08 | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing More |
| IEC 60749-31 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) More |
| IEC 60749-31 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) More |
