NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62435-3 ; VDE 0884-135-3:2022-05 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 62435-1 ; VDE 0884-135-1:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (IEC 62435-1:2017); German version EN 62435-1:2017 More |
| DIN EN 62435-2 ; VDE 0884-135-2:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms (IEC 62435-2:2017); German version EN 62435-2:2017 More |
| DIN EN 62435-5 ; VDE 0884-135-5:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017 More |
| DIN IEC/TR 61340-5-2 ; VDE 0300-5-2:2019-04 | 2019-04 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide (IEC TR 61340-5-2:2018) More |
| EN 190000 | 1995-06 | Generic specification: Monolithic integrated circuits More |
| IEC 60749-20-1 | 2019-06 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 61340-5-1 | 2016-05 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements More |
| IEC 62258-1 | 2009-04 | Semiconductor die products - Part 1: Procurement and use More |
| IEC 62258-2 | 2011-05 | Semiconductor die products - Part 2: Exchange data formats More |
