NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62878-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 62137-1-4 | 2009-01 | Surface mounting technology - Environmental and endurance test methods for surface-mount solder joints - Part 1-4: Cyclic bending test More |
| IEC 62878-1-1 | 2015-05 | Device embedded substrate - Part 1-1: Generic specification - Test methods More |
| IEC/TR 62878-2-2 | 2015-12 | Device embedded substrate - Part 2-2: Guidelines - Electrical testing More |
| IEC/TS 62878-2-1 | 2015-03 | Device embedded substrate - Part 2-1: Guidelines - General description of technology More |
| IEC/TS 62878-2-3 | 2015-03 | Device Embedded Substrate - Part 2-3: Guidelines - Design Guide More |
| IEC/TS 62878-2-4 | 2015-03 | Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG) More |
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-45 | 1980 | Environmental testing. Part 2: Tests. Test XA and guidance: Immersion in cleaning solvents More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 62421 | 2007-08 | Electronics assembly technology - Electronic modules More |
